
| IPAMA智管會/TSipo戰國策 李文強Conway/王維位 發表 2009/06/25 |
LED運用在背光模組(backlight)之專利地圖
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使用THOMSON REUTERS之Aureka軟體來統計自USTPO,EPO,JP,WIPO公開、公告專利資料庫,共8476筆專利(patent family篩除後),由上圖可以看到目前將LED當作背光源,主要有幾種技術的瓶頸存在,故各大廠在此幾種技術瓶頸上不斷投入研發並申請專利保護,造成將LED當作背光源有3大技術類別的專利群組,分別為:
背光模組中可用LED作為光源之導光板(Light guide plate)與反射板(Reflector)相關技術之專利群組
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在此專利群組中其相關技術如US7537373中,背光模組中導光板的改良為具有兩種細微構造的菱鏡相互交錯設置於導光板上,能將光線全方位收斂並垂直入射至 LCD;而專利數量前三名的公司依序為:HON HAI PREC IND CO LTD、SAMSUNG ELECTRONICS CO LTD、AU OPTRONICS CORP;而專利申請數量則是以2006年申請的數量為最多,達41筆申請數量,第二為2007年的31筆;最早出現的專利為MOTOROLA INC於1985/06/06在美國所申請的US4630895。
背光模組中可用LED作為光源之改善色域(color gamut)
相關技術之專利群組
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在此專利群組中其相關技術如US20070132676中,不需使用color filter而是直接使用RGB光源的背光模組;專利數量前三名的公司依序為:TOPPAN PRINTING CO LTD、SONY CORP、KONINKL PHILIPS ELECTRONICS NV;而專利申請數量則是以2007年申請的數量為最多,達30筆申請數量,第二為2006年的22筆;最早出現的專利為HITACHI LTD於1987/04/30在日本所申請的JP63271229A。
背光模組中可用LED作為光源之散熱技術的專利群組
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在此專利群組中,專利數量前三名的公司依序為:MATSUSHITA ELECTRIC IND CO LTD、SAMSUNG ELECTRONICS CO LTD、SONY CORP;而專利申請數量則是以2005年申請的數量為最多,達27筆申請數量,第二為2006年的24筆;最早出現的專利為NIPPON SEIKI CO LTD於2000/12/21在日本所申請的JP2002189220A。以下將進一步將此專利群組繪製專利地圖。
進一步繪製背光模組中可用LED作為光源之散熱技術之專利地圖
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由此專利地圖可以看到主要幾種技術的專利群組,如US7481567、US7520637中結合超高導熱石墨(graphite)、銅箔(copper)來解決散熱問題;如EP2063174,則是在背光模組中加裝一金屬底座(Chassis)來傳遞LED所產生的熱量至設備外部;或是如US7527408中所提到的背光模組中有一散熱層(heat dissipating layer)來吸收反射板(reflector)所傳送光產生的熱量。
US7481567、US7520637、EP2063174、US7527408專利詳細列表
公告(公開)號 |
US7481567 |
專利名稱 |
Backlight assembly and liquid crystal display device using the same |
申請日 公告日 |
2006/01/20 2009/01/27 |
申請人(國家) |
Samsung Electronics Co., Ltd. |
摘要 |
A backlight assembly and a liquid crystal display device can discharge heat from the lamp unit to the outside or effectively dissipate the heat. The backlight assembly of the present invention includes a lamp unit, a receiving member for receiving the lamp unit, a first heat dissipation member disposed below the receiving member, and a second heat dissipation for wrapping around a lateral side of the receiving member and the first heat dissipation member. The lamp unit is disposed on an area corresponding to the lateral side of the receiving member. In one embodiment, the first heat dissipation member is a flat plate made of graphite and disposed on an outer side of the bottom of the receiving member. The second heat dissipation member is metal with good thermal conductivity in close contact with the first heat dissipation member and the lateral side of the receiving member where the lamp unit is disposed. Thus, the heat discharged from the lamp unit can be distributed uniformly over the entire area of the receiving member. In addition, the lateral side of the receiving member where the lamp unit is disposed can be replaced with the second heat dissipation member. |
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專利範圍第一項或其他相關之專利範圍 |
1. A backlight assembly, comprising: a light source; a receiving member having a rectangular shape comprising a bottom plate and four sidewalls extending from respective sides of the bottom plate, the receiving member having an inner surface and an outer surface, the receiving member receiving the light source, the light source being adjacent to the inner surface of one of the sidewalls; a first heat dissipation member disposed on the outer surface of the bottom plate of the receiving member; and a second heat dissipation member disposed on the outer surface of the one of the sidewalls of the receiving member and on the first heat dissipation member. 2. The backlight assembly as claimed in claim 1, wherein the first heat dissipation member comprises a flat plate disposed on a portion of the bottom plate, the portion of the bottom plate being adjacent to the light source.
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From:IPAMA智管會整理
公告(公開)號 |
US7520637 |
專利名稱 |
Backlight unit and liquid crystal display device |
申請日 公告日 |
2005/10/31 2009/04/21 |
申請人(國家) |
LG Display Co., Ltd. |
摘要 |
A backlight unit and an LCD device are provided, in which an LED (light emitting diode) is used as a light source of the backlight unit, and the heat generated from the LED is rapidly discharged to the outside. The backlight unit includes in one embodiment a cover bottom; at least one heat pipe located on the cover bottom; and a plurality of light sources located on the at least one heat pipe at fixed intervals. |
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專利範圍第一項或其他相關之專利範圍 |
1. A backlight unit comprising: a cover bottom; at least one heat pipe located on the cover bottom, wherein the at least one heat pipe includes a first plate and a second plate facing each other, a first wick on a surface of the first plate facing an opposite surface of the second plate and a second wick on the opposite surface of the second plate, and a sealing layer for providing a sealed space between the first and second plates and a working fluid being in the sealed space between the first and second plates, wherein the first plate and the second plate are made of copper and the working fluid is made of water; and a plurality of LEDs (light emitting diodes) located on the at least one heat pipe at fixed intervals. 2. The backlight unit of claim 1, wherein the plurality of LEDs include red R, green G and blue B light emitting diodes. 7. The backlight unit of claim 1, further comprising: a reflecting sheet for reflecting light emitted from the LEDs; and a graphite spreader, located on a bottom surface of the reflecting sheet, for discharging heat generated from the LEDs. 8. The backlight unit of claim 7, wherein the graphite spreader surrounds at least one of the LEDs, the heat generated by at least one of the LEDs being conducted to the graphite spreader.
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From:IPAMA智管會整理
公告(公開)號 |
EP2063174 |
專利名稱 |
BACKLIGHT DEVICE AND DISPLAY DEVICE USING SAME |
申請日 公告日 |
2006/09/13 2009/05/27 |
申請人(國家) |
SHARP KK [JP] |
摘要 |
A backlight device (3) is provided with a substrate (9) whereupon a plurality of light emitting diodes (10) are arranged, and a lower side chassis (heat dissipating unit) (6) where heat generated by the light emitting diodes (10) is transferred from the substrate (9) and dissipated to the outside. An amount of heat generated by each light emitting diode (10) is measured in advance, and in accordance with the measurement results of the amounts of generated heat, an arrangement position on the substrate (9) is determined and corresponding light emitting diodes (10) are arranged. |
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專利範圍第一項或其他相關之專利範圍 |
1. A backlight device provided with a plurality of light emitting diodes, the back light device comprising: 2. The backlight device according to claim 1, wherein a metallic material having heat conductivity is used in the substrate.
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From:IPAMA智管會整理
公告(公開)號 |
US7527408 |
專利名稱 |
Backlight unit having heat dissipating layer, display device having heat dissipating layer, and method for manufacturing heat dissipating layer |
申請日 公告日 |
2006/08/21 2009/05/05 |
申請人(國家) |
LG Electronics Inc. |
摘要 |
A backlight unit and a display device having heat dissipating layer, and a method for manufacturing the heat dissipating layer are provided. A backlight unit includes a light source for emitting a light; a reflector below the light source for reflecting the light emitted from the light source and absorbing heat generated by the light source; and a heat dissipating layer including thermal conductive particles, the heat dissipating layer being disposed on a first surface of the reflector for dissipating the heat transferred to the reflector. |
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專利範圍第一項或其他相關之專利範圍 |
1. A backlight unit, comprising: a light source for emitting a light; a reflector below the light source for reflecting the light emitted from the light source and absorbing heat generated by the light source; a heat dissipating layer including thermal conductive particles, the heat dissipating layer being disposed on and in direct contact with a first surface of the reflector for dissipating the heat transferred to the reflector; a light guide plate for guiding the light emitted from the light source, the light source being located at least one lateral side of the light guide plate; and a light source reflector above the reflector and surrounding the light source, wherein the reflector and the heat dissipating layer have a length larger than a length of the light guide plate and are disposed directly below the light source reflector for absorbing the heat transferred to the light source reflector. 8. The backlight unit of claim 1, wherein the light source is at least one of a cold cathode fluorescent lamp (CCFL), a light emitting diode (LED) and an external electrode fluorescent lamp (EEFL).
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From:IPAMA智管會整理
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